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How to Improve the Yield of Hard and Brittle Materials Processing?
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How to Improve the Yield of Hard and Brittle Materials Processing?

2026-02-03
In the high-precision machining of hard and brittle materials such as ceramics, optical glass and semiconductor wafers, core challenges including edge chipping, microcracks, surface damage and unstable tool service life have long been encountered. Such materials impose extremely high requirements on surface and subsurface integrity.
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The precision machining of such hard and brittle materials demands that tools achieve a delicate balance at the micro level:
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  1. Balance between holding force and self-sharpening ability: The matrix must firmly grip diamond or CBN abrasive grains to prevent premature detachment during high-speed cutting and grinding; meanwhile, it should allow worn abrasive grains to shed in a timely manner, exposing new cutting edges to maintain the continuous sharpness of the tool.
  2. Balance between high rigidity and impact resistance: For ultra-hard workpieces, the matrix needs to provide sufficient hardness for support; yet under interrupted machining or vibrating working conditions, it must possess excellent toughness to resist impacts and avoid chipping and cracking of the tool itself.
  3. Balance between wear resistance and high thermal conductivity: To achieve a long service life, the matrix must be highly wear-resistant. However, the massive heat generated during machining must be rapidly dissipated; otherwise, it will burn heat-sensitive materials (such as semiconductor wafers) or cause graphitization of diamond.
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Accordingly, pre-alloyed Copper-cobalt / copper-tin based materials, with their designable compositions and uniform microstructures, integrate the contradictory yet essential properties of the tool—strong grain holding, tough impact resistance and rapid heat dissipation—into a stable matrix. This elevates such materials beyond the category of single tool components, making them a key fundamental technology that systematically addresses the bottlenecks in the precision machining of hard and brittle materials, and supports the manufacturing upgrading of high-end industries including semiconductors and new energy.

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