What Role Does Sagwell Ultrafine Copper Powder Play in Conductive Adhesives?

Today, let's talk about conductive adhesives. Conductive adhesives generally consist of resin, conductive materials, copper powderand other additives. Among conductive materials, Metal Powders such as gold, silver, copper and nickel are widely used in China. Gold and silver offer the best electrical conductivity but are extremely costly.

Conductive adhesives are widely applied in the electronics and electrical industries. Silver was the earliest and most commonly used conductive filler. Compared with silver, copper has very similar electrical conductivity (resistivity). So can ultrafine Copper Powder be used in conductive adhesives? Can it replace expensive gold or silver?

First, let's look at the requirements for conductive materials: the material must have high electrical conductivity, with a suitable particle size to form conductive pathways within the adhesive matrix. The loading of conductive fillers is usually at least 60%. Tests show that conductivity is optimal at a content of 80–90%, while resistivity rises significantly when the content falls below 60%.

The resistivity of silver is 1.59×10⁻⁸ Ω·m, and that of copper is 1.72×10⁻⁸ Ω·m. Theoretically, replacing silver with copper is feasible. For instance, some customers use Sagwell ultrafine copper powder F2‑Cu to produce silver‑coated copper powder through electroplating, which maintains performance while greatly reducing costs.

Can ultrafine copper powder  be used in other types of conductive adhesives? Can it resolve the oxidation issue encountered when using pure copper powder alone? We welcome further discussion with you.