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Superfine Pure Copper Powder: F6-Cu

Superfine Copper Powder

Superfine Pure Copper Powder: F6-Cu

Copper powder F6-Cu

High Electrical Conductivity

Spherical Shap.

High Sinterability.

Good Flowability.

    Features

    1. High Sinterability.
    2. High Electrical Conductivity.
    3. Spherical Shap.
    4. Good fluidity.

    Application

    Suitable for:
    Making high-grade diamond tools.
    Electronics and Electrical Conductors
    Additive Manufacturing (3D Printing)
    Powder metallurgy
    Metal Injection Molding (MIM)
    • metal powder for PM and MIMh3y
    • metal powder for electronic componentsyz5
    • metal powder for diamond toolsvr9

    Data

    Grade

    Cu Content

    O Content

    C Content

    Particle Size D50
    (μm)

    Specific Surface Area

    F6-Cu

    Bal. 

    1700-3900  ppm

    400-700  ppm

    2.0-3.8

    0.35-0.6 m2/g

    Related products

    Grade

    Cu(%)

    O(%)

    Particle Size D50
    (μm)

    Apparent Density
    (g/cm3)

    Tap Density
    (g/cm3)

    F1-Cu

    ≥99.5

    <0.3

    2.8-3.8

    -

    ≥3.5

    F2-Cu

    >99.5

    ≤0.5

    4.0-6.0

    2.0-2.8

    3.7-4.5

    F3-Cu

    >99.7

    ≤0.2

    2.0-3.0

    0.7-1.1

    2.6-3.2

    F4-Cu

    >99.7

    <0.25

    7.0-11.0

    2.7-3.2

    3.9-4.3

    F5-Cu

    ≥99.5

    ≤0.25

    3.0-5.0

    3.0-3.6

    4.8-5.8

    X-Cu

    >99.7

    ≤0.25

    15.0-20.0

    2.8-3.3

    3.5-4.0

    The above product data and application suggestions may change due to product optimization, performance improvement, and other reasons. The current content is for reference only. Please contact us for the latest data.

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